Philip Feng currently Professor at Herbert Wertheim College of Engineering, University of Florida, USA. His group’s research is primarily focused on advanced semiconductors (including 2D crystals and wide bandgap materials), emerging nanoscale devices, quantum engineering, and integrated micro/nanoscale systems. He received his Ph.D. in Electrical Engineering from Caltech. He was one of the 81 young engineers selected to participate in the National Academy of Engineering (NAE) 2013 U.S. Frontier of Engineering (USFOE) Symposium. Subsequently, he was selected to receive the NAE Grainger Foundation Frontiers of Engineering (FOE) Award in 2014. His recent awards include the NSF CAREER Award, several Best Paper Awards (with his advisees, at IEEE and American Vacuum Society (AVS) conferences), a university-wide T. Keith Glennan Fellowship, the Case School of Engineering Graduate Teaching Award (2014) and the Case School of Engineering Research Award (2015). A Senior Member of IEEE, he has served on the Technical Program Committees (TPC) and as Track/Session Chairs for IEEE IEDM, IEEE MEMS, Transducers, IEEE IFCS, IEEE SENSORS, IEEE NANO, etc., and as the MEMS/NEMS Chair for American Vacuum Society (AVS) 61^st to 63^rd International Symposia